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Which identity and contained the purpose so you can effortlessly imagine everything we treated because the “disk” inside the English and you can “disco” in the Foreign language both show the design of your blade or grinding controls.
At first, DISCO was applied just while the label of your All of us part, nevertheless the term of the headquarters is commercially converted to DISCO Corporation in the 1977. Covert dicingTM are a good dicing techniques in which an altered covering are molded by paying attention a great laser beam in the workpiece, following which fret try used on the exterior to split up they on the die. Because the silicone polymer wafers will be split up that have a relatively touch away from be concerned, the new perish is going to be split up by growing the new dicing tape.
- DISCO try in the first place a knife/grinding wheel manufacturer under the identity away from Dai-Ichi Seitosho CO., Ltd.
- So it term in addition to contained all of our purpose to with ease guess what we handled because the “disk” inside English and you can “disco” in the Language both display the shape of your own blade or grinding wheel.
- In the beginning, DISCO was used simply because the label of your All of us subsidiary, nevertheless the term of the headquarters are theoretically converted to DISCO Corporation within the 1977.
- Consolidation of an array of systems techniques – technical, electric, physics, chemicals, and you can guidance processing – produces very high value-additional semiconductors.
- Currently, most of DISCO items was produced to your semiconductor design process of highly cutting-edge technologies away from numerous organizations in different variations.
- Covert dicingTM try a dicing process in which an altered level is actually formed by the focusing an excellent laser beam within the workpiece, after the and that stress is applied on the outside to separate your lives it for the perish.
What sort of organization is DISCO?
Concurrently, product that have higher physical power such SiC wafers that will be popular to possess electricity devices and you may sapphire wafers used in Led can’t be broke up by simply expansion. DDS2020 try a perish separator one achieves separation away from tough information such as SiC and you will sapphire that have a low stream playing with an excellent the fresh breaking device.
Growth of DKL7640: Finding More effective GaN Wafer Design by using the KABRA Processes
Regarding the DISCO DISCO try a great semiconductor devices name brand that provides reliability processing gizmos, as well as dicing saws and you can grinders, and precision processing products (blades and you may wheels) used for production semiconductors and you will digital section. At the moment, much of DISCO points was delivered to your semiconductor development processes of extremely advanced tech of hundreds of companies in different variations. Integration of many systems process – technical, electrical, physics, chemical substances, and you may suggestions running – produces very high well worth-additional semiconductors. Another shows you the brand new spots you to definitely DISCO servers play on the semiconductor production process. DISCO are to begin with a blade/milling controls brand under the name of Dai-Ichi Seitosho CO., Ltd. In the 1969, in the event the organization, which in fact had set up their organization just domestically, reach export on the You, DISCO was used for the first time for easy pronunciation delivering the fresh initials of your business term.